The Physical Layer
Fabs, process nodes, packaging, HBM, equipment - why only a handful of companies can make any of it.
Every engineered system runs with margin - headroom between what it does today and what it physically cannot exceed. When that margin runs out, roadmaps slip, capex gets rewritten, and the demo that went viral quietly never ships.
Fabs, process nodes, packaging, HBM, equipment - why only a handful of companies can make any of it.
Power, cooling, materials, capacity. What is actually constraining AI buildouts, and what breaks next.
What a robotics demo does and does not prove, and what would have to become true for it to ship.
All three end in the same place: what it means for margins, capex, and the companies you may own.
A 35% US chip-fab tax credit applies only if construction begins by December 31, 2026. What counts as a start, and what missing it costs.
Partners report that Model Hardware Standard cuts device integration from weeks to hours. The part it cannot automate is the knowledge of how a machine may safely move, and the standard hands that to the people who use the hardware.
Berkeley Lab projects average US data center PUE falling to 1.15-1.35 by 2028 while average site WUE rises to 0.45-0.48 L/kWh, and names the shift to hyperscale and colocation as a cause of both. Most of the water is not on the site meter at all.
Language models train on text that already existed. The dataset robotics calls large-scale and in-the-wild is 350 hours, produced by 50 people over a year.